Machinery for Crystal devices
	(Blank Mounter) Placing a Crystal chip(blank) on the SMD package with paste. Image Processor control. High through put. High precision. High compatibility.
	(Conveyor oven) Conveyor oven for drying paste and fixing the blank. Connective with Blank Mounter. Clean heat. N2 atmosphere.
	(Mask Pick and Placer) Placing Crystal chips(Blank) onto plating mask. Image Processor control . High through put.
	(Lid Welding machine) Mounting and welding a lid on the SMD package. Good maintenance.
	(Inspection machine) Check and measure for Electric curve and it's taping.
	(Temperature Curve Tester) Testing temperature curve for devices.
	(Taping machine) Taping SMD devices on the emboss tape.
	(Flip Chip Bonder) This is the number 1 speed and high precision US connection Flip Chip Bonder for small electronics devices in the industry. Flip Chip Bonding for TCXO, Crystal oscillator, SAW device, Optical device, and other electronic devices.
	(Bump Bonder) Forms bump putt directly on the wafer before dicing by the ball bonding system. Bump Bonding for Si wafer, Sheet PCB SAW (Ta, Nb), Resin PCB, Laser Diode.
	(Dispenser) It is automatic Dispenser using image processor for multiple works with high precision. Under fill bonding for TCXO after FC mounting, and Crystal oscillator. Over coat bonding after wire bonding process, and for other electronic devices.
Machinery for Display
	(ACF TAB Bonder) Automatic ACF bonding and TAB Compressing . Image processor positioning control for panel and TAB. Automatic TAB loader.
	(TAB Bonder) TAB compressing on the glass. Automatic Teflon tape feeder. Multi bonding .
Others
(Inspection device for accelerate sensor.)
(Manufacturing for Camera module.)
* Handling the various manufacturing equipments for electronic devices. Please consult us freely.