Covers ACF laminating on glass panel. Covers mounting and heat bonding of TCP or FPC in high speed and high precision after ACF laminating on glass panels, as a fully automatic inline system.
Features
Consists of module-structured units. (Respective control enables respective operation setting.)
Batch production is also available.
Temporary heat bonding precision of ±8μm and 3σ or less and final heat bonding precision of 10μm and 3σ or less are realized.
Panel conveyance by two and structure of 4 heads for final heat bonding enables high-speed mounting. Work supply is available during operation.
