This fully automatic bonding system covers ACF laminating, IC chips mounting, and heat bonding on a glass panel or a FPC.
Features
Consists of module-structured units.
(Respective control enables respective operation setting.)
Batch production is also available.
Processing precision of ±5μm and 3σ is obtained.
(Higher precision is available in high precision mode.)
IC chip mounting on up to 3 sides is available and each of them can be more than one.
Up to 2 kinds of IC chips can be supplied and supply trays up to 4 inches are acceptable. Work supply is available during operation.
